Oxidative Remediation
Introduction and Benefits
As you might imagine, not all mold remediation methods, solutions and services are the same, and effectiveness, safety and environmental impacts differ widely from one to another. Most remediation methods treat mold as a physical substance versus a biologic contaminate, and have a negative environmental impact. Oxidative Remediation, however, is an environmentally safe process designed specifically to address the unique challenges associated with bio-contamination.
Traditional mold remediation methods developed during the 1970's were designed to contain and remove inert hazardous materials like asbestos. In an attempt to remove bio-contamination, these methods were modified to address the removal of mold contamination, but they are not effective in dealing with the unique challenges associated with bio-contaminate removal and control.
This modified process employs destructive/abrasive removal of surface contamination, air scrubbing to remove airborne contaminates created during abrasive removal, HEPA vacuuming to remove surface contamination remaining after abrasive removal, and the use of powerful antimicrobial pesticides intended to kill surviving bio-growth. While this protocol removes the visible bulk contamination, embedded spores that survive the process are still able germinate once the environment becomes favorable to mold growth.
New remediation protocols based upon Oxidative Remediation are specifically designed to solve the unique challenges associated with bio-contamination. These protocols address both fungal viability and fungal allergenicity. Fungal Viability is the potential for fungal growth when minimal growing conditions are met. Because mold spores can remain in stasis (dormant) for decades, unless they are destroyed, they remain viable. Fungal Allergenicity is the potential to cause an immune response or allergic reaction when exposed to the proteins common to fungi. An important fact is that all mold is classified as an irritant capable of creating an allergic reaction in those who are susceptible to its exposure.
As mentioned above, traditional remediation methods do not resolve the fungal viability issue because spores can easily survive the process. Sanding, vacuuming, and the use of powerful antimicrobial pesticides simply have no effect on fungal allergenicity, so to be effective, bio-remediation protocols must address growing and dormant mold as well as the fungal proteins that cause irritation and allergenic responses.
Oxidative remediation protocols were developed from research that addressed the threat of bio-terrorism during the 1990's. These protocols employ a highly effective chemical reaction that creates reactive super-hydroxyl radicals. These hydroxyl radicals attack and decompose cellular proteins, carbohydrates, lipids and amino acids associated with all bio-contamination, and upon contact, complex cellular proteins and other organic compounds are reduced to their basic chemical form. Once these complex proteins are digested, they are no longer a threat to our immune system. Simply stated, Oxidative remediation converts proteins from a hyper-allergenic to a hypo-allergenic state.
Oxidative remediation is not only more effective against bio-contamination than traditional methods, but is also environmentally safe because the chemical byproducts generated during oxidation quickly break down into elemental oxygen and water. The process does not used chlorine, pesticides, poisons, heavy metals, or other environmentally dangerous chemicals, and there are no dangerous residues remaining after remediation. Because the chemistry is applied in a liquid form under pressure, it can penetrate deeply into porous surfaces, cracks and crevices where other methods cannot reach, and the end result is the most effective level of biologic decontamination.
Remediation Questions
Q. - Does mold just grown on the top of a surface?
A. - No, mold grows much like a mushroom. It produces a root called a hyphal projection that penetrates into porous surfaces. The mold colony uses this root for attachment and as a transport system for absorbing nutrients.
Q. - Can sanding or brushing remove sub-surface contamination?
A. - While sanding, brushing, or abrasion may remove the bulk of visible contamination, these techniques cannot reach microscopic subsurface growth. In fact, during the abrasion process, spores and fungal fragments can be driven deeper into the surface. In addition, surface abrasion aerosolizes contamination, potentially spreading contamination.
Q. - Is media blasting effective at removing mold contamination?
A. - Any form of surface abrasion drives contamination deeper into surfaces and causes the release of massive levels of airborne contamination. Further, some techniques utilize soda as a blasting media which simply dislodges the surface fungal growth into a fine powder that cannot be HEPA vacuumed. In addition, soda is a caustic agent. As with other abrasive protocols, while surfaces may look clean, viable microscopic spores remain.
Q. - Are chlorine, poison, or pesticide based chemicals effective at killing mold?
A. - The US Department of Labor, OSHA, and the Directorate of Science, Technology and Medicine has issued a safety bulletin warning against the use of biocides and chlorine for mold remediation. Not only are some of these chemicals potentially dangerous, they are only effective on hard nonporous surfaces and even then only on actively growing microorganisms. Dormant spores hiding in porous surfaces are unaffected by these chemicals.
Q. - Do traditional remediation methods address the allergenic potential of bio-contamination?
A. - No, biocides, poisons, heavy metals, disinfectants have no effect on fungal proteins. Any fungal proteins that survive sanding, vacuuming, and disinfection remain a potential allergenic contaminate. Proteins must be denatured (digested) in order to be converted from hyper-allergenic to hypo-allergenic components. The only process proven to digest fungal proteins is oxidative chemical decontamination.
OSC-500 - Oxidizing Surface Cleaner
Product Description - OSC-500 is an advanced stabilized oxidizing surface cleaner designed for mold remediation professionals. While there are other oxidizing cleaners on the market, our proprietary blend of cleaners and powerful surfactants provides superior surface cleaning properties. OSC-500 is a professional grade remediation product designed to replace caustic sodium hypochlorite formulas. Unlike these formulations, OSC-500 does not pose an exposure hazard, it is not reactive with metals, will not damage surfaces, and leaves no residue.
OSC-500 cleans as it oxidizes mold growth and surface stains. As the product comes in contact with organic contamination, it quickly denatures proteins, lipids, and carbohydrates common among all microorganisms. The characteristic foaming action indicates the presence of these proteins and lifts contaminates away from surfaces, while destroying mold, mildew, and algae.
OSC-500 removes fungal spores and hyphae on contact. It can be used on: wood, siding, drywall, walls, canvas, fiberglass, vinyl, plastic, patio furniture, shower stalls, toilet areas, counters, cabinets, and other water safe surfaces. Oxidative Remediation is an environmentally safe process that addressed both fungal viability and allergenicity. It begins working on contact and continues to attack fungal proteins for over 15 minutes. The surfactant formulation ensures deep penetration into cracks, crevices, and porous surfaces. Fungal contamination cannot hide.
OSC-500 is an effective cleaner on wood, brick, concrete, siding, roofing materials, fiberglass, gelcoat, vinyl, plastic, bathroom surfaces, and outdoor furniture.
OSC-500 Highlights:
- Effectively cleans mold, algae and other bacterial strains from surfaces.
- Deeply penetrates porous surfaces.
- Quickly digests even the densest bio-films.
- Powerful oxidative chemistry denatures fungal proteins.
- Environmentally safe with no dangerous outgassing or byproducts created during use.
- Reduces overall remediation time by 50% when compared to traditional methods.
- Reduces remediation costs by 25% when compared to traditional methods.
- Proven to be the safest and most effective protocol for fungal remediation.
OSC-500 is a surface cleaner and not a bleach. Some deep set organic stains on wood surfaces may not be completely eliminated. This is not an indication of active mold growth or dormant spores. To ensure maximum protection against future mold growth and to protect surfaces from microbial deterioration, apply Biostat-Pro™. Biostat-Pro is an EPA registered biostatic mold inhibitor designed specifically for the remediation industry.
For more information on Oxidative Remediation procedures and effectiveness, please contact BioTek Environmental.
